The meat of these modules is their 3D image sensor, which is co-developed by PMD and Infineon. The former provides its time-of-flight pixel architecture, and the latter takes charge of the CMOS chip manufacturing - including the integration of an intelligent sequence programmer, a matrix modulation driver and an A/D converter. Such level of functionality integration is apparently the highest in the 3D image sensor category, and this can save circuitry space as well as cost. These guys have so far announced the IRS1010C sensor with a 160 x 120 resolution, as well as the more powerful IRS1020C sensor with a 352 x 288 resolution.
Engadget , PMD and Infineon show off CamBoard Pico and Pico S, tiny 3D depth cameras for integration (video), PMD and Infineon show off CamBoard Pico and Pico S, tiny 3D depth cameras for integration (video)
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